January 10, 2008 - Qualcomm took the opportunity to show off their upcoming Snapdragon platform at CES 2008, a platform which will power the next generation of Windows Mobile devices from manufacturers such at HTC and Samsung.
At the core of Snapdragon is a new ARM-based dual core mobile processor running at clock speeds up to 1GHz. The platform also allows for HSDPA and EV-DO 3G connectivity, Wi-Fi, Bluetooth, digital camera processing up to 12 megapixels, GPS, HD video decoding and more.
The Qualcomm QSD8250 chipset offers downlink HSDPA connectivity up to 7.2Mbps with backward compatibility for slower connections. The QSD8650 offers connectivity with the same GSM/GPRS/EDGE/HSDPA networks as the QSD8250, as well as CDMA EV-DO Rev. B.
